发明名称 |
I/O circuit placement method and semiconductor device |
摘要 |
An I/O circuit placement method. In the I/O circuit placement method, at least two rows of I/O circuits are placed on a first side of the chip, and each I/O circuit has a head section and a tail section. The placement direction of the head section and the tail section is perpendicular to the placement direction of the I/O circuits in the rows. The semiconductor further has a core circuit disposed on the chip, wherein the rows of I/O circuits are disposed outside the core circuit and are at the periphery of the chip. Due to the I/O circuit placement in the semiconductor device, the present invention reduces the area of the semiconductor chip and fabrication cost.
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申请公布号 |
US2005127405(A1) |
申请公布日期 |
2005.06.16 |
申请号 |
US20030733095 |
申请日期 |
2003.12.11 |
申请人 |
CHEN WANG-JIN;FAN CHEN-TENG;HUANG CHENG-I;LIU YA-YUN |
发明人 |
CHEN WANG-JIN;FAN CHEN-TENG;HUANG CHENG-I;LIU YA-YUN |
分类号 |
G06F9/45;H01L23/48;H01L23/52;H01L27/02;H01L27/118;(IPC1-7):G06F9/45 |
主分类号 |
G06F9/45 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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