| 摘要 |
<P>PROBLEM TO BE SOLVED: To protect electronic components or the other wiring patterns from a long time pressure caused by the bending of a radio communication module or the like. <P>SOLUTION: This radio communication module is configured of a substrate 112, an electronic component 130 mounted on the substrate, a wiring pattern 116 formed on the substrate, a first reinforcing member 118 adhered to the electronic component through thermosetting adhesive 122 while it is assembled for reinforcing the strength of the electronic component after it is finished and a barrier member 212 arranged in the surrounding of the electronic component so as to prevent the thermosetting adhesive from being uni-directionally spread due to the pressurizing force of the first reinforcing member. Thus, it is possible to protect the electronic component or the other wiring patterns from a long time pressure caused by the bending of the radio communication module. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
