发明名称 |
PRINTING PROCESS AND SOLDER MASK INK COMPOSITION |
摘要 |
A process for making an electronic device which comprises applying a non-aqueous solder mask ink which is substantially free from organic solvent to a dielectric substrate containing electrically conductive metal circuitry, exposing the solder mask ink to actinic radiation and/or particle beam radiation optionally followed by thermal treatment, whereby the solder mask ink is applied to selected areas of the substrate under the control of a computer by ink jet printing and wherein the solder mask ink comprises the components: A) 30 - 90 parts acrylate functional monomers which are mono or higher acrylate functional monomers comprising from 5 - 95 % by weight of one or more monofunctional monomers; B) 0.1 - 30 parts metal adhesion promoting organic compound; C) 0 - 30 parts initiator; D) 0 - 10 parts polymer and/or prepolymer; E) 0 - 5 parts colorant; E) 0 - 5 parts surfactant; and Wherein all parts are by weight.
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申请公布号 |
KR20050057461(A) |
申请公布日期 |
2005.06.16 |
申请号 |
KR20057004709 |
申请日期 |
2005.03.18 |
申请人 |
AVECIA LIMITED |
发明人 |
HOPPER ALAN JOHN;JAMES MARK ROBERT |
分类号 |
C09D11/00;H05K3/28;(IPC1-7):G03F7/027 |
主分类号 |
C09D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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