| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for containing a semiconductor element and a semiconductor device for air-tightly housing the semiconductor element, and for sufficiently dissipating heat to be generated from a semiconductor element. SOLUTION: This package for containing a semiconductor element is provided with a plate-shaped metal substrate 1 in which a mounting part 1a for mounting a semiconductor element 4 is formed on an upper main surface, a metal frame body 2 soldered on the upper main surface of the substrate 1 so that the mounting part 1a can be surrounded, and formed with a mounting part 2a of an input/output terminal 3 formed on one side section by notching the lower side; and the ceramic input/output terminal 3 engaged with the mounting part 2a, and formed with metallized wiring layers 3a for electrically conducting the inside and outside of the frame body 2. The substrate 1 is configured so that the arithmetic mean roughness of the site to be soldered to the frame body 2 on the upper main surface can be set so as to be ranging from 0.01 to 0.1μm. COPYRIGHT: (C)2005,JPO&NCIPI
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