Slurry distributor for chemical mechanical polishing apparatus and method of using the same

摘要

A polishing apparatus ( 100 ) is provided for polishing a substrate ( 102 ) that has slurry distributor ( 125 ) which improves planarization uniformity. Generally, apparatus ( 100 ) includes: (i) platen ( 106 ) with polishing surface ( 110 ); (ii) head ( 116 ) adapted to hold substrate ( 102 ) against polishing surface; (iii) mechanism to rotate platen ( 106 ) during polishing; (iv) dispenser ( 124 ) having nozzles ( 126, 128 ) to dispense slurry on the surface ( 110 ); and (v) distributor ( 125 ) between the nozzles ( 126, 128 ) and head ( 116 ). In one embodiment, apparatus ( 100 ) further includes a wiper ( 180 ) between head ( 116 ) and distributor ( 125 ) to remove used slurry and polishing byproducts from surface ( 110 ), thereby reducing agglomerations or deposits that can damage substrate ( 102 ) and improving yield. Optionally, apparatus ( 100 ) further includes dispenser ( 186 ) for dispensing a fluid before and/or after wiper ( 180 ) to substantially eliminate buildup of deposits. Method for polishing and substrate polished according to method.