| 摘要 |
PROBLEM TO BE SOLVED: To prevent an increase in the resistance of a via hole by the contraction of a conductive material filling the via hole formed to electrically connect layers. SOLUTION: A through-hole is formed to an electrode provided within a substrate like a flash circuit, and the internal diameter of the through-hole at the center side of the thickness of a substrate is small or the internal diameter in the intermediate side is large. Therefore, the conductive material entering the through-hole is caught. Moreover, since the conductive material is in contact with an electrode in the hole and in the internal side of the substrate, the contraction of the conductive material is distributed and the reduction of a contact area with the electrode by the contraction can be prevented. In addition, the electrode is roughed for enlarging a contact area with the conductive material and for an anchor effect. COPYRIGHT: (C)2005,JPO&NCIPI |
