MANUFACTURING METHOD OF GRINDING DEVICE, RETAINER RING AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the uniformity of grinding of the outer peripheral part of a grinding object held by the retainer ring.

SOLUTION: The retainer ring 4 is constituted so that a contacting surface with a grinding cloth 2 is constituted of the same material as that of a grinding surface of a wafer W or a material whose principal constituent is the material of grinding surface of the wafer W.

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