| 摘要 |
A semiconductor device includes a substrate on which are formed a first group and a second group of leads; and a semiconductor chip having a first group and a second group of electrodes, the first group and a second group of electrodes being arranged respectively on both sides of a region between first and second straight lines, the first and second straight lines being parallel to each other. The semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. Each of the second group of leads has a bent portion, the bent portion being formed so that a contour of an inner side of each bend of the bent portion draws a curve. |
