发明名称 METHOD FOR MANUFACTURING PACKAGE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To solve a problem in which since it is difficult for a conventional washing machine to completely wash a package after a cutting stage because of the external shape of a recessed part itself is small, cut powder etc. is left in the recessed part because of incomplete washing and sticks on an electronic element mounted in the recessed part in a subsequent stage to possibly exert an adverse influence on characteristics of the electronic element. SOLUTION: Disclosed is a method for manufacturing a package for an electronic component that includes stages of: forming a plurality of recessed parts at specified places on one main surface of a plate type insulating material, electrode pads for element connection on bottom surfaces of the recessed parts, and a plurality of electrode pads for external connection at specified places on the other main surfaces; sticking an adhesive sheet or tape on the one entire main surface of the insulating material having the plurality of recessed parts opened; and cutting only the insulating material from the other main surface side where the electrode pads for external connection are formed to separate the insulating material into a plurality of packages for electronic components. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159206(A) 申请公布日期 2005.06.16
申请号 JP20030398664 申请日期 2003.11.28
申请人 KYOCERA KINSEKI CORP 发明人 ONO SATOSHI
分类号 H01L23/12;H01L23/08;(IPC1-7):H01L23/12 主分类号 H01L23/12
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