| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a metal pillar having a high aspect ratio on the surface of an IC pattern, a substrate or the like. <P>SOLUTION: Plasma is uniformly generated at the part along a gap of a comb teeth electrode and an oxygen gas is decomposed to generate an oxygen radical. The generated oxygen radical is introduced to a lower plasma processing room and discummed by the oxygen radical. More specifically, the existing scum is decomposed by the oxygen radical, and a side wall of an opening is roughened regardless of the existence of the scum and immersed in a plating solution. This fills a metal (a gold, copper, aluminum or the like) in the opening to obtain a metal pillar by removing the resist film by ashing. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
