发明名称 SURFACE TREATMENT METHOD FOR OBJECT TO BE TREATED, AND TREATMENT DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment method for the object to be treated, e.g., suitable for electroplating to the object to be treated, with which treatment fluid used for each treatment in electroplating is circularly fed in succession, and a series of treatments are rationally and speedily performed, thus the improvement of productivity and mass-production are attained, and further, a dense and homogeneous thin plated film having satisfactory follow-up properties can be obtained, and to provide a treatment device therefor. SOLUTION: The surface treatment device for the object to be treated comprises a circulation path 8 into which a reaction tank 1 capable of storing the object 2 to be treated and prescribed surface treatment fluid is inserted. In the surface treatment method for the object to be treated, at the time when the object 2 to be treated is subjected to surface treatment, prescribed surface treatment fluid is circulated. The reaction tank 1 is equipped so as to be capable of electrochemical reaction. When the object 2 to be treated is subjected to surface treatment, prescribed surface treatment fluid is circulated through the circulation path 8. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005154816(A) 申请公布日期 2005.06.16
申请号 JP20030393247 申请日期 2003.11.25
申请人 ASAHI KASEI ENGINEERING KK;YOSHIDA HIDEO 发明人 SATO NOBUYOSHI;NISHIMURA KEIJI;YOSHIDA HIDEO;ABE KENTARO;SONE MASATO;MIYATA SEIZO
分类号 C25D17/00;(IPC1-7):C25D17/00 主分类号 C25D17/00
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