| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem by warpage that, in formings produced by a laser beam lithography method, warpage is more liable to occur, and in the case this is used for dies, clearance is formed at the faces in which the male die and the female die are contacted in the directions to which clamping pressure is applied, i.e., at the parting faces. SOLUTION: The dies 1 and 2 are formed as laser beam lithography each obtainable by repeating the process where a prescribed part in a layer of a metal powder material is irradiated with a light beam, thus the powder in the part is sintered to form a sintered layer; a new layer of the powder material is applied to the surface of the sintered layer, and then, a prescribed part is irradiated with a light beam, thus the powder in the part is sintered to form a new sintered layer integrated with the sintered layer in the lower layer. Deformation parts deformed by pressure at the time of clamping are formed on the laser beam lithography at the faces to which clamping pressure is applied with the die as a counterpart or the back sides thereof. Warpage is absorbed by the deformation in the deformed parts by the pressure at the time of clamping. COPYRIGHT: (C)2005,JPO&NCIPI
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