发明名称 |
Semiconductor package assembly and method for electrically isolating modules |
摘要 |
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package assembly and method are suitable for electrically isolating modules according to IEEE 1394.
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申请公布号 |
US2005130347(A1) |
申请公布日期 |
2005.06.16 |
申请号 |
US20050040575 |
申请日期 |
2005.01.20 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
QUINLAN SION C.;BALES TIM J. |
分类号 |
H01L23/64;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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