| 摘要 |
<p>The invention relates to a testing head for microstructures. The testing head (1) includes a top guide plate (2) and bottom guide plate (3), separated by an air gap (9). Each of the plates (2, 3) include respective guide holes (4, 5) for accommodating a contact probe (6) having a contact tip (7) that is arranged to mechanically and electrically contact a contact pads (8) on a device under test. The contacting tip (7) of the testing head (6) has a non-zero pitch angle ( alpha OUT) relative to the contact pad (8), and "scrubs" the pad as the device under test is drawn against the contacting tip (7), causing the contact probe (6) to bend within the air gap (9). The invention further relates to a method for creating an electro/mechanical connection between a testing head for microstructures and a device to be tested. <IMAGE></p> |
