发明名称 |
BOARD FOR PRINTED WIRING, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING THEM |
摘要 |
A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 mu m or less and the maximum particle diameter of which is 15 mu m or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface. <IMAGE> |
申请公布号 |
EP1542518(A1) |
申请公布日期 |
2005.06.15 |
申请号 |
EP20030730747 |
申请日期 |
2003.06.02 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HAYASHI, N.;OKA, Y.;KANDA, MASAHIKO;YAGI, N.;MIYAZAKI, K.;NAKATSUGI, K. |
分类号 |
H05K3/12;H05K1/09;H05K3/10;H05K3/16;H05K3/24;H05K3/38;(IPC1-7):H05K3/12 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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