发明名称 Multiple exposure method for forming a patterned photoresist layer
摘要 A method for exposing a blanket photoresist layer employs: (1) a first direct write exposure of the blanket photoresist layer to form therein an exposed peripheral sub-region of a desired exposed pattern; and (2) a second masked photoexposure of the blanket photoresist layer to form therein a masked photoexposed bulk sub-region of the desired exposed pattern which overlaps but does not extend beyond the exposed peripheral sub-region. The once masked photoexposed once direct write exposed blanket photoresist layer may be developed to form a patterned photoresist layer employed for forming a patterned opaque layer border within an opaque bordered attenuated phase shift mask.
申请公布号 US6905802(B2) 申请公布日期 2005.06.14
申请号 US20030637862 申请日期 2003.08.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIN CHENG-MING
分类号 G03C5/00;G03F1/00;G03F7/00;G03F7/20;G03F9/00;(IPC1-7):G03F9/00 主分类号 G03C5/00
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