| 摘要 |
A semiconductor laser device has a laser chip and a submount therefor. The submount has a fore end surface inclined in a direction of thickness of the submount. The laser chip is mounted on the submount in such a manner that an edge line of the fore end surface is perpendicular to a light emission axis of the laser chip, and that a light-emitting end surface of the laser chip projects from the edge line by a projection length in the direction of the light emission axis of the laser chip. Thereby, the laser chip receiving no return light is easily positioned with high accuracy.
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