Process for molding on a substrate

摘要

A process of molding a component on a substrate utilizes a substrate having a peripheral flange that projects into a parting line between mold segments defining a mold cavity, wherein the flange has a projecting, continuous circuitous ridge that forms a seal between the substrate and an upper mold segment. The process allows a substantially flash free molded component to be formed directly on a substrate, thus eliminating the need for a separate flash removal step.