| 摘要 |
PURPOSE: A multilayer-plated lead frame and a fabricating method thereof are provided to enhance the wire bonding force and reduce the environmental pollution by excluding an Sn/Pb plating process. CONSTITUTION: A multilayer-plated lead frame includes a metallic substrate layer, a nickel layer, a palladium layer, a silver layer, and a gold layer. The metallic substrate layer(31) is formed with a copper layer or a copper alloy layer. The nickel layer(32) is formed on an upper surface of the metallic substrate layer. The palladium layer(33) is formed on an upper surface of the nickel layer. The silver layer(34) is formed on an upper surface of the palladium layer. The gold layer(35) is formed on an upper surface of the silver layer. |
