发明名称 HIGH FREQUENCY PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a high frequency package wherein a resonant frequency occurring in the package is out of a used frequency band because the high frequency package has a plurality of notches (openings) having specific resonant frequencies as an antenna and the resonant frequency is within the used frequency band in a high frequency band. <P>SOLUTION: The package is provided with a metallic frame 2 wherein an opening 8 is provided on a metallic bottom plate 1 to be connected with an external terminal, a dielectric 3 that is formed on the metallic bottom plate 1 and where a high frequency transmission line and a plurality of input/output terminals are formed on its surface, a microwave circuit 6 housed within the metallic frame 2, and a metallic cover 9. The resonant frequency of the opening 8 generating in an electric field between the metallic frame 2 and the metallic bottom plate 1 is made outside the used frequency band by reducing the width of the opening 8 and optimizing it. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150345(A) 申请公布日期 2005.06.09
申请号 JP20030384948 申请日期 2003.11.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 ASAO HIDEKI;KOSAKATA HIROSHI;OHASHI HIDEMASA;SHINOZAKI KYOKO;TADANO KENJI
分类号 H05K9/00;G01N27/72;H01L23/02;H01L23/04;H01P3/08;H01Q13/10;H04B1/38 主分类号 H05K9/00
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