发明名称 METHOD AND APPARATUS FOR MANUFACTURING LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To improve bonding force between green sheets and also to easily peel the green sheet and a temporary base material. SOLUTION: The green sheet 331 is deposited with pressure on a laminated green sheet material 330 while the ultrasonic wave is applied using an ultrasonic wave head unit 120. With the ultrasonic wave, organic binders are bonded with each other owing to friction heat at the surfaces where the green sheets 331 are bonded with each other. Since acoustic impedances are different with each other in the green sheet 331 having the soft property and the temporary base material 340 having the hard property, the bonding force is lowered by applying the ultrasonic wave and thereby the temporary base material can be peeled off easily from the green sheet. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150219(A) 申请公布日期 2005.06.09
申请号 JP20030382466 申请日期 2003.11.12
申请人 TDK CORP 发明人 SUDO JUNICHI;YOSHIDA MASAYUKI;SHINDO HIROSHI;WATANABE GENICHI
分类号 B28B11/00;H01G4/12;H01G4/30;H05K3/46;(IPC1-7):H01G4/12 主分类号 B28B11/00
代理机构 代理人
主权项
地址