| 发明名称 |
Process for preparation of semiconductor wafer surface |
| 摘要 |
A method for adjusting the resistivity in the surface of a semiconductive substrate including selective measurement and counter-doping of areas on a major surface of a semiconductive substrate.
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| 申请公布号 |
US2005124085(A1) |
申请公布日期 |
2005.06.09 |
| 申请号 |
US20030728482 |
申请日期 |
2003.12.04 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
ANDOH KOHJI;CHIOLA DAVIDE |
| 分类号 |
H01L21/66;(IPC1-7):H01L21/66;G01R31/26 |
主分类号 |
H01L21/66 |
| 代理机构 |
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