摘要 |
<p>The largest stress is created in the vicinity of the boundary between an edge of a bus bar electrode in a solar cell and a surface of a semiconductor substrate, and stresses are easily concentrated. Accordingly, defects such as micro cracks occur in the semiconductor substrate, which develop into a large craze with the defects as its starting point. In connecting bus bar electrodes 4a and 5a in the solar cell by an inner lead 8, therefore, a solder 6 is not brought into contact with edges along the longitudinal direction of the bus bar electrodes 4a and 5a and portions F from the edges to a predetermined distance a inward therefrom, and is brought into direct contact with a filler 10.</p> |
申请人 |
KYOCERA CORPORATION;FUJII, SHUICHI;KANEKO, TOSHIHIKO;TSUGE, TAKASHI;SHIRASAWA, KATSUHIKO |
发明人 |
FUJII, SHUICHI;KANEKO, TOSHIHIKO;TSUGE, TAKASHI;SHIRASAWA, KATSUHIKO |