| 摘要 |
PROBLEM TO BE SOLVED: To provide a premolding semiconductor device in which there is no problem such as a moisture absorption and a resin peeling, the inclination of a semiconductor chip (such as an optical element) or the like, and which has a heatsink having an excellent degree of adhesion with a resin; and to provide a manufacturing method for the semiconductor device. SOLUTION: In the premolding semiconductor device 10, the semiconductor chip 26 is loaded on an element loading section 12 which is sealed with the resin with top faces left on the element loading side of a plurality of leads 13 disposed around the element loading section 12, and a hollow section 18 is formed to the upper element loading section, and a manufacturing method for the semiconductor device 10, the heat sink 21 is caulked and connected to the element loading section 12 while forming an opening in which the sealing resin 23 enters. COPYRIGHT: (C)2005,JPO&NCIPI |
