发明名称 MANUFACTURING METHOD FOR LASER-BEAM MACHINED PRODUCT, AND LASER-BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a laser-beam product and a laser beam apparatus, in which the influence due to interference fringes of a laser beam is reduced with a simple process and a simple structure of an apparatus. <P>SOLUTION: A TFT board 11 supported by a mount table 40 is irradiated with a laser beam LB through a window 51 of a local machining part 50, and a short-circuited part 12A of a wiring pattern 12 is corrected. The laser beam LB is applied while moving the TFT board 11 with respect to a slit 30 and an objective lens 31 by the mount table 40. The interference fringes are moved on the TFT board 11, and unevenness of irradiation strength is eliminated, so that uniform machining is conducted without generating remains of film. The TFT board 11 is preferably moved in a direction in which the interference fringes generated by the laser beam LB are aligned. Further, the laser beam LB is preferably applied at each time when the TFT board 11 is moved by a distance of 1/2 length of the pitch of the interference fringes. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005144527(A) 申请公布日期 2005.06.09
申请号 JP20030388827 申请日期 2003.11.19
申请人 SONY CORP 发明人 KOSHIISHI AKIRA
分类号 B23K26/08;B23K101/42;(IPC1-7):B23K26/08 主分类号 B23K26/08
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