| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which, when a plurality of semiconductor chips are displaced and laminated, a connection between an electrode and a metal wiring in a projected portion of the semiconductor chips is enhanced, and the deterioration of the semiconductor chips due to a stress in resin sealing is suppressed. <P>SOLUTION: The semiconductor device comprises a die pad 200; a first semiconductor chip 4 having a front face 41 formed with a first electrode 47 and a rear face 42 fixed to the die pad 200; a second semiconductor chip 5 having a front face 51 formed with a second electrode 57, and a rear face 52 fixed to the front face 41 of the first semiconductor chip 4; a support member 300 having a front face 301 fixed to the rear face of the second semiconductor chip 5, and a rear face 302 fixed to the die pad 200; lead terminals 210, 220 electrically connected to first and second electrodes 47, 57; and a resin sealing body 10 sealing the die pad 200, the first and second semiconductor chips 4, 5, and the support member 300. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
