| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film used by attaching it to an electronic device component and a package such as packaging container, capable of sufficiently suppressing static charge generated in contact and/or friction of the attached package with the contents by attaching the film and further suppressing induced static buildup from the package, etc. SOLUTION: The adhesive film is obtained by forming an adhesive layer on a substrate film containing a vinylidene fluoride polymer, an acrylate-based polymer and carbon black as main components. In the adhesive film, the substrate film comprises, preferably, carbon black in an amount of 5-30 pts.wt. based on 100 pts.wt. total amount of the resin component and further, the surface resistance value of the adhesive layer is preferably≤10<SP>10</SP>Ω/sq. COPYRIGHT: (C)2005,JPO&NCIPI
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