发明名称 |
Integrated circuit and method of manufacturing an integrated circuit and package |
摘要 |
A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace configuration alleviates routing congestion in an IC package and permits an IC to accommodate a greater number of channels within a given surface area than is possible under the prior art.
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申请公布号 |
US2005121766(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20050031774 |
申请日期 |
2005.01.07 |
申请人 |
DEVNANI NURWATI S.;BARNES JAMES O.;MOORE CHARLES E.;LAI BENNY W.H. |
发明人 |
DEVNANI NURWATI S.;BARNES JAMES O.;MOORE CHARLES E.;LAI BENNY W.H. |
分类号 |
H01L21/44;H01L23/498;H01L23/52;H01L23/64;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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