发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board that has small-diameter via holes and via conductors, and to provide a method by which the wiring board can be manufactured surely. SOLUTION: The wiring board K comprises a core substrate (lower insulating resin layer) 1, wiring pattern layers 4 and 5 respectively formed on the front and rear surfaces 2 and 3 of the substrate 1, and upper insulating resin layers 6 and 7 formed on the surfaces of the core substrate 1 and wiring pattern layers 4 and 5. The wiring board K also comprises via holes 10 and 11 formed through the upper insulating resin layers 6 and 7, and via conductors 12 and 13 formed in the via holes 10 and 11 and electrically connected to the wiring pattern layers 4 and 5. The upper insulating resin layers 6 and 7 contain an epoxy resin containing an inorganic filler having a mean particle diameter of 1.0-10.0μm and composed of SiO<SB>2</SB>as the main ingredient at a rate of 30-50 wt.%. At the same time, the diameters of the openings of the via holes 10 and 11 at the lower ends on the side of the wiring pattern layers 4 and 5 are adjusted to≥40μm and <60μm. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150553(A) 申请公布日期 2005.06.09
申请号 JP20030388493 申请日期 2003.11.18
申请人 NGK SPARK PLUG CO LTD 发明人 SAIKI HAJIME;SAKURAI MIKIYA
分类号 H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/00
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