发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which is capable of manufacturing a stabilized thin film transistor with high characteristics, since a crystalline semiconductor film formed by utilizing a lateral growth method employing a capping method is constituted of a crystal excellent in crystallinity. SOLUTION: The manufacturing method of semiconductor device is provided with a substrate and the crystalline semiconductor film laminated directly or indirectly on the substrate. The method comprises a process for laminating an amorphous semiconductor film directly or indirectly on the substrate, a process for laminating a first cap film and a second cap film which are in a specialized positional relation mutually on the surface of the amorphous semiconductor film, a process for melting a part of the amorphous semiconductor film in solid state into liquid state by irradiating laser light on the cap films, and a process for crystallizing the liquid state semiconductor to change the same into the crystalline semiconductor film. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150438(A) 申请公布日期 2005.06.09
申请号 JP20030386522 申请日期 2003.11.17
申请人 SHARP CORP 发明人 OKAZAKI SHINYA;NAKAYAMA JUNICHIRO;INUI TETSUYA
分类号 H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
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