| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a support pin arrangement position determining device for determining the arrangement position of support pins, less liable to damage the lead of an electronic component that has been packaged on the rear face of a substrate, and without the need to remove soldering. <P>SOLUTION: The support pin arrangement position determining device is provided with: a database portion 607 storing a component packaging point data 607b, a component shape data 607c, and a support pin mountable position (support pin plate data 607a) in a support pin plate for mounting a support pin; a support pin arrangement position determining program storage part 605 with the storage of a support pin arrangement position determining program for determining the support pin arrangement position of the support pin to the mountable position on the basis of the component packaging point data and the component shape data; and an operation processing part 601 executing the program. The component shape data is the data of a shape with a fixed width added to the shape of the component itself. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
