POLISHING PAD HAVING GROOVE FOR IMPROVING AVAILABILITY OF SLURRY

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad and polishing method by which the wasteful use of slurry supplied to a polishing layer can be reduced by reducing the amount of non-effectively utilized slurry.

SOLUTION: The polishing pad is a chemical mechanical polishing pad 200 which contains the polishing layer 204 having a polishing area 208 and containing a plurality of grooves 212 at least partially extended into the polishing area 208. During the course of polishing, the grooves 212 contain slurry which makes polishing easier. Each groove 212 contains a plurality of mixing structures arranged to mix the slurry in the lower part of the groove with the slurry in the upper part of the groove.

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