发明名称 |
Capillary structure to reduce heat transfer resistance between two connected metal surfaces as in semiconductor elements fills capillary tubes with solder during production |
摘要 |
<p>A capillary structure for reducing heat transfer resistance between two connected metal surfaces comprises filling the capillaries with solder during the production process. Preferably the capillary structure comprises small channels in the surfaces and the solder is of tin/lead or tin/silver/copper.</p> |
申请公布号 |
DE202004019985(U1) |
申请公布日期 |
2005.06.09 |
申请号 |
DE20042019985U |
申请日期 |
2004.12.27 |
申请人 |
LEE, FREDERICK |
发明人 |
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分类号 |
F28F13/00;H01L23/367;(IPC1-7):F28F13/00;F28F21/08;H01L23/34;H01L23/488 |
主分类号 |
F28F13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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