发明名称 MOLD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a mold assembly which can form a desired vacuum pressure space in a cavity by improving the sealing properties of a mold in a clamping state. SOLUTION: In this mold assembly, an open air shut-off member 29 which is clamped through sealing members S5 and S6 between a top force base 21 and a bottom force base 1 and shuts off a gap communicating with a clamping surface, is detachably provided encircling the outsides of a top force chase 18 and a bottom force chase 4. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005144968(A) 申请公布日期 2005.06.09
申请号 JP20030388403 申请日期 2003.11.18
申请人 APIC YAMADA CORP 发明人 AKAOKA TAKAAKI;NISHIZAWA KENJI
分类号 B29C45/26;B29C45/34;B29K105/20;H01L21/56;(IPC1-7):B29C45/26 主分类号 B29C45/26
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