| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicone reactive hot melt adhesive composition superior in thermal stability when heated and melted, capable of quickly hardening after adherence, and excellent in generation of heat resistance of a film. SOLUTION: This reactive hot melt adhesive composition comprises a thermoplastic polymeric compound that comprises a hydrolytic silyl group such as an alkoxysilyl group, an organic group functionable as a hydrolytic catalyst for the hydrolytic silyl group, which is preferably a tertiary amino group or a carboxyl group, and a nitrogen atom containing bond selected from a urethane bond, a thiourethane bond, a urea bond, a substituted urea bond and a chemical bond derived from a Michael addition reaction in a molecule. COPYRIGHT: (C)2005,JPO&NCIPI
|
