发明名称 RESIN SEALING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing apparatus capable of separating a package and a scrap from a cavity plate without damaging the package and the scrap. SOLUTION: A degating part 5 is adapted such that the cavity plate 1 is clamped with an upper clamp unit A and a lower clamp unit B, and the scrap 25 and a work W are separated from the cavity plate 1 by pressing the scrap 25 and the package part 24 through a transparent hole in the cavity plate 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150407(A) 申请公布日期 2005.06.09
申请号 JP20030386074 申请日期 2003.11.17
申请人 APIC YAMADA CORP 发明人 TOUFUKUJI SHIGEYUKI;KANAI MASAYA
分类号 B29C45/38;B29K105/22;B29L9/00;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/38
代理机构 代理人
主权项
地址