Land grid array packaged device and method of forming same

摘要

A method of packaging an integrated circuit die ( 12 ) includes the steps of forming an array of soft conductive balls ( 14 ) in a fixture ( 30 ) and flattening opposing sides of the balls. The flattened balls are then transferred from the fixture to a mold masking tape ( 36 ). A first side of the IC die is attached to the balls with a die attach adhesive ( 16 ) and then wire bonding pads ( 20 ) on the die are electrically connected directly to respective balls with wires ( 22 ). An encapsulant ( 24 ) is formed over the die, the electrical connections, and a top portion of the formed balls. The tape is removed and adjacent, encapsulated dice are separated via saw singulation. The result is an encapsulated IC having a bottom side with exposed balls.