发明名称 |
Connector for making electrical contact at semiconductor scales |
摘要 |
A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
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申请公布号 |
US2005124181(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20030731669 |
申请日期 |
2003.12.08 |
申请人 |
BROWN DIRK D.;WILLIAMS JOHN D.;RADZA ERIC M. |
发明人 |
BROWN DIRK D.;WILLIAMS JOHN D.;RADZA ERIC M. |
分类号 |
G01R1/04;G01R1/067;G01R3/00;H01L23/32;H01L23/48;H01R12/04;H01R13/03;H01R13/24;H01R43/00;H01R43/20;H05K3/32;H05K3/40;H05K7/10;(IPC1-7):H01R12/00 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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