发明名称 CONDUCTIVE POLISHING ARTICLE FOR ELECTROCHEMICAL MECHANICAL POLISHING
摘要 Embodiments of a polishing article for processing a substracte are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
申请公布号 WO2004108358(A3) 申请公布日期 2005.06.09
申请号 WO2004US17827 申请日期 2004.06.07
申请人 APPLIED MATERIALS, INC.;HU, YONGQI;DUBOUST, ALAIN;MANENS, ANTOINE, P.;TSAI, STAN, D.;BUTTERFIELD, PAUL, D.;WANG, YAN;LIU, FENG, Q.;NEO, SIEW, S.;CHEN, LIANG-YUH;TIAN, YUAN, A.;KO, SEN-HOU;EWALD, ROBERT, A. 发明人 HU, YONGQI;DUBOUST, ALAIN;MANENS, ANTOINE, P.;TSAI, STAN, D.;BUTTERFIELD, PAUL, D.;WANG, YAN;LIU, FENG, Q.;NEO, SIEW, S.;CHEN, LIANG-YUH;TIAN, YUAN, A.;KO, SEN-HOU;EWALD, ROBERT, A.
分类号 B23H5/08;B24B37/20;B24B37/22;C25F7/00 主分类号 B23H5/08
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