POLISHING PAD HAVING GROOVE STRUCTURE FOR REDUCING CONSUMPTION OF SLURRY

摘要

PROBLEM TO BE SOLVED: To provide a polishing layer having grooves formed to reduce the wasteful use of slurry supplied to the layer by reducing the amount of non-sufficiently utilized slurry.

SOLUTION: A polishing pad 200 comprises the polishing layer 204 having a polishing area 208 for polishing a wafer 220. The polishing layer 204 contains one set of inflow grooves 232 extended to the polishing area 208 and one set of outflow grooves 236 extended from the polishing area 208. The inflow and outflow grooves 232 and 236 cooperate to improve the availability of polishing slurry while the wafer is polished.

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