发明名称 |
Manufacturing methods for printed circuit boards |
摘要 |
A method of forming a plurality of solid conductive bumps for interconnecting two conductive layers of a circuit board with substantially coplanar upper surfaces. The method comprises the steps of applying a continuous homogenous metal layer onto a dielectric substrate, applying a first photoresist and exposing and developing said first photoresist to define a pattern of conductive bumps, etching the metal layer exposed by said development to form said plurality of conductive bumps, removing said first photoresist, applying a second photoresist onto the metal layer, exposing and developing said second photoresist to define a pattern of conductive bumps and circuit lines; etching the metal layer exposed by said development to form a pattern of circuit lines in said metal layer; and removing said second photoresist. The methods of the present invention also provides for fabricating a multilayer circuit board and a metallic border for providing rigidity to a panel.
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申请公布号 |
US2005124096(A1) |
申请公布日期 |
2005.06.09 |
申请号 |
US20050029969 |
申请日期 |
2005.01.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
APPELT BERND K.;BUPP JAMES R.;FARQUHAR DONALD S.;KEESLER ROSS W.;KLODOWSKI MICHAEL J.;SEMAN ANDREW M.;SCHILD GARY L. |
分类号 |
H05K3/06;H05K3/20;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H01L21/82;H01L21/44 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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