发明名称 CIRCUIT SUBSTRATE MANUFACTURING METHOD AND SYSTEM, SUBSTRATE USED FOR THE SAME, AND CIRCUIT SUBSTRATE USING THE SAME
摘要 <p>There is provided a circuit substrate manufacturing method for manufacturing a circuit substrate in two steps: the first step for manufacturing a substrate at a substrate manufacturer (1) and the second step for mounting electronic parts on the substrate for manufacturing a circuit substrate at a mounting manufacturer (2). At one or more division stages, the substrate board (5) is divided via substrate sheets (6) to substrate pieces (7). By using the substrate board (5), identification information consisting of information associated with the entire substrate board and information indicating relative relationship by divisions at each division stage is recorded on respective information recording units (8, 9, 10) arranged to correspond to the substrates before and after the division at each division stage before the substrates are delivered from the substrate manufacturer (1) to the mounting manufacturer (2). By referencing the identification information, it is possible to easily trace the history, i.e., trace a manufacturing progress of the circuit substrate divided and a manufacturing history when a defect is caused while increasing the productivity of the circuit substrate by using the multi-piece substrate.</p>
申请公布号 WO2005052705(A1) 申请公布日期 2005.06.09
申请号 WO2004JP17467 申请日期 2004.11.25
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;KOBAYASHI, TOKUMI 发明人 KOBAYASHI, TOKUMI
分类号 G05B19/418;H01L23/544;H05K1/02;H05K3/00;(IPC1-7):G05B19/418 主分类号 G05B19/418
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