| 摘要 |
PROBLEM TO BE SOLVED: To improve the coverage reliability of an insulating layer provided over a wiring structure, such as a coil or the like. SOLUTION: In a wiring structure, such as a planar coil or the like, interconnect lines 2 formed of conductor are formed on a board 1 with an insulating surface, an insulating layer damming wall structure 3 is provided around the outermost part of the interconnect lines 2 while it is not electrically connected to the interconnect lines 2, and the insulating layer 4 is formed over the interconnect lines 2 and the damming wall structure 3. COPYRIGHT: (C)2005,JPO&NCIPI |
