| 摘要 |
A low-stress silicon-backed light valve package assembly that includes a matched coefficient of thermal expansion (CTE) substrate with a CTE no greater than 300% of the CTE of silicon, a silicon-backed light valve adhered to the matched CTE substrate by a soft adhesive layer, a flexible circuit adhered to the matched CTE substrate and electrically connected to the silicon-backed light valve, an encapsulant dam surrounding the silicon-backed light valve and a soft encapsulant layer filling the cavity defined by the encapsulant dam. Both the soft encapsulant layer and the soft adhesive layer have a Shore A hardness of less than 5. The combination of a soft encapsulant layer, soft adhesive layer and matched CTE substrate insure sufficiently low mechanical stress levels to avoid the presence of optical interference patterns in the light valve display. |
