发明名称 SEMICONDUCTOR DEVICE MOUNTED WITH METAL INSULATOR METAL (MIM) STRUCTURE RESISTOR
摘要 PROBLEM TO BE SOLVED: To realize a metal resistor which can be formed in the latter half of the process of a semiconductor in addition to a polysilicon resistor formed in the first half of the process as the resistor on the semiconductor substrate. SOLUTION: A capacitor 27 is formed by providing a lower electrode 14, a capacitance insulating film 16, and an upper electrode 17 in this order. Even in a resistor structure 28 of MIM structure, a lower electrode 15, the capacitance insulating film 16, and a resistor 18 are provided in this order. In this case, bias conditions are set so as to make the lower electrode 15 of the resistor structure of MIM structure resistor 28 in a floating state without connecting any potentials. Therefore, even when a signal of a high frequency is impressed to the metal resistor 18, the high frequency characteristic of the device mounted with the metal resistor is good since it is hardly affected by parasitic capacitance because the lower electrode 15 of the resistor structure is put into the floating state. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005142531(A) 申请公布日期 2005.06.02
申请号 JP20040244321 申请日期 2004.08.24
申请人 NEC ELECTRONICS CORP 发明人 KIKUTA KUNIKO;NAKAYAMA MAKOTO
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8234;H01L27/06;H01L27/088;(IPC1-7):H01L21/822;H01L21/823 主分类号 H01L27/04
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