| 摘要 |
PROBLEM TO BE SOLVED: To enhance the bonding strength between an epoxy and gold in the electrical connection of gold to another metal and of gold to gold in an ultrasonic image pick-up probe. SOLUTION: This method for bonding one surface to a gold surface comprises the steps of (a) mixing a sulfur-containing alkoxysilane solution, (b) treating a gold surface with the solution, (c) adding a sulfur-containing alkoxysilane to an adhesive, (d) applying the adhesive containing the additive to either of the surfaces, and (e) pressing both surfaces against each other while the adhesive applied between them is cured. COPYRIGHT: (C)2005,JPO&NCIPI |
