| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for printing a resist by which a resist can be printed while following up on a shape of level difference without being influenced by a warpage of a board, even when there is a significant level difference or warpage in the board and also can be printed in a simpler way and in a shorter time than by a conventional method, in a process for manufacturing a metal-ceramic joint circuit board. SOLUTION: In the method for printing the resist on the metal-ceramic joint circuit board 10 with a metal sheet 14 for a circuit joined to one of the sides of a ceramic board 12 and a metal base sheet 16 for heat dissipation of a larger size than the ceramic board 12 joined to the other side, the resist is printed almost on the entire surface surrounding the ceramic board 12 on the upper surface (the surface of the ceramic board 12 side) of the metal base sheet 16 using a pad printing machine 100. COPYRIGHT: (C)2005,JPO&NCIPI
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