| 发明名称 |
Thermal solution for electronic devices |
| 摘要 |
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source. |
| 申请公布号 |
EP1536313(A2) |
申请公布日期 |
2005.06.01 |
| 申请号 |
EP20040256484 |
申请日期 |
2004.10.21 |
| 申请人 |
ADVANCED ENERGY TECHNOLOGY INC. |
发明人 |
SMALC, MARTIN DAVID;SHIVES, GARY D.;REYNOLDS III, ROBERT ANDERSON |
| 分类号 |
H05K9/00;G06F1/18;G06F1/20;H01L23/373;H01L23/552;H05K7/20;(IPC1-7):G06F1/20 |
主分类号 |
H05K9/00 |
| 代理机构 |
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