发明名称 |
Hot wall rapid thermal processor |
摘要 |
An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.
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申请公布号 |
US6900413(B2) |
申请公布日期 |
2005.05.31 |
申请号 |
US20020261963 |
申请日期 |
2002.10.01 |
申请人 |
AVIZA TECHNOLOGY, INC. |
发明人 |
RATLIFF CHRISTOPHER T.;KOWALSKI JEFFREY M.;QIU TAIQING |
分类号 |
C23C16/455;C23C16/458;C30B25/10;C30B25/14;F27B5/14;F27B5/16;F27D1/18;F27D3/00;H01L21/00;(IPC1-7):F27B5/14 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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