| 摘要 |
The connection structure is obtained by electrically connecting first electrodes on a first substrate 1 and second electrodes on a second substrate with an interposed anisotropic electroconductive adhesive layer 5 so as to satisfy Eq. 1 below<paragraph lvl="0"><in-line-formula>0.5x{(A1C1+A2C2)/(B+C)}<=X<=2x{(A1C1+A2C2)/(B+C)} (1)</in-line-formula>where A1 is the height of each first electrode, B1 is the electrode width thereof, C1 is the width of the interelectrode space, A2 is the height of each second electrode, B2 is the electrode width thereof, C2 is the width of the interelectrode space (B+C=B1+C1B2+C2), and X is the thickness of the electroconductive adhesive layer prior to connection. |
